Method and arrangement for attaching a component

Details Method and arrangement for attaching a component Method and arrangement for attaching a component

1998-02-26

2000-06-13

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

22818022, 2281801, 22818021, 228245, 228 563, 2281231, 228254, 228209, 228211, H05K 334

Patent

active

060738294

ABSTRACT:
The invention is related to a method of fabricating an attachment bump of a component (11). In accordance with the invention, a flexible preform (13a) is fabricated, which is plated with materials (13b) appropriate for metallurgical bonding. The invention is also related to a method of attaching a component (11) to the surface of a circuit card (15) using bumps. In accordance with the invention, bumps are formed from preforms (13a) made from a flexible material, which preforms (13a) are metallized (13b) over their entire surface. The bump (13a, 13b) is attached to the attachment pads (12a, 16a) of the component (11) and the circuit card (15) by means of metallizations (12b, 13b, 16b) between the attachment pads and the bump. The bond is formed metallurgically by transfusion. The surface of the bonding side of the component (11) is coated with an insulating material (14) before the mentioned bonding elsewhere than at the attachment pads (12). The mentioned insulating material (14) is thermoplastic, thermoplastic resin or thermosetting plastic in the B state. To accomplish metallurgical bonding of the bonding material, bismuth (Bi) is used as part of the material.

REFERENCES:
patent: 5320272 (1994-06-01), Melton et al.
patent: 5431328 (1995-07-01), Chang et al.
patent: 5508228 (1996-04-01), Nolan et al.
patent: 5551627 (1996-09-01), Leicht et al.
patent: 5773359 (1998-06-01), Mitchell et al.
"Characteristics and Potential Application of Polyimide-Core-Bump to Flip Chip", Nishimori et al., Proceedings of Electronic Components & Technology Conference (ECTC) 1995, pp. 515-519.

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