Method and apparatus using nanotubes for cooling and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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C257S717000, C257S712000, C257S706000, C165S185000, C174S016300, C361S704000

Reexamination Certificate

active

06856016

ABSTRACT:
An embodiment of the present invention described and shown in the specification and drawings is a process and a package for facilitating cooling and grounding of a semiconductor die using carbon nanotubes in a thermal interface layer between the die and a thermal management aid. The embodiments that are disclosed have the carbon nanotubes positioned and sized to utilize their high thermal and electrical conductance to facilitate the flow of heat and current to the thermal management aid. One embodiment disclosed has the carbon nanotubes mixed with a paste matrix before being applied. Another disclosed embodiment has the carbon nanotubes grown on the surface of the semiconductor die.

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