Method and apparatus to locate and measure capillary indentation

Details Method and apparatus to locate and measure capillary indentation Method and apparatus to locate and measure capillary indentation

1995-08-31

1998-11-10

Chang, Jon

Image analysis

Applications

Manufacturing or product inspection

382150, 382174, 382291, G06K 920

Patent

active

058356223

ABSTRACT:
A method and apparatus for locating and measuring capillary indentation marks on wire bonded leads by creating a normalized, one-dimensional circumferential projection of a candidate center location in an image of a capillary indentation mark and detecting signals in the one-dimensional circumferential projection that correspond to a predefined pattern. The one-dimensional circumferential projection can be generated and evaluated for a full or a sub-sampled set of candidate center locations according to a number of different methods.

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