Method and apparatus to hold integrated circuit chips onto a chu

Details Method and apparatus to hold integrated circuit chips onto a chu Method and apparatus to hold integrated circuit chips onto a chu

1998-04-15

2000-02-15

Scherbel, David A.

Abrading

Abrading process

Glass or stone abrading

451388, 125 2301, 125 12, B24B 100

Patent

active

060246316

ABSTRACT:
A cutting chuck for use with a cutting blade and for holding a semiconductor wafer in place during a dicing process and a die pick for picking the segmented semiconductor wafer from the chuck. The chuck includes a surface for supporting the wafer and several ports in the surface connected to a vacuum source. Preferably, the cutting chuck includes a housing having a base and a wall. A vacuum chamber is provided within the housing and on top of the base. A porous layer is located in housing and above the vacuum chamber. A surface layer is above the porous layer and contains ports connecting the surface supporting the wafer to the vacuum chamber via the porous layer. In a most preferred embodiment, the chuck is removeably attached to the vacuum source via a check valve. The cutting chuck may also include recesses in the surface to prevent impingement on the cutting chuck by a cutting blade during wafer dicing. The die pick includes a pick head having a surface for contacting the plurality of die sawn from a wafer. The surface includes a plurality of ports that are in fluid communication with a vacuum source. The die pick picks the plurality of die from the chuck for further processing.

REFERENCES:
patent: 3004766 (1961-10-01), Bryant
patent: 3690780 (1972-09-01), Bjelland et al.
patent: 3809050 (1974-05-01), Chough et al.
patent: 3811182 (1974-05-01), Ryan, Sr. et al.
patent: 3976288 (1976-08-01), Cuomo, Jr.
patent: 4138304 (1979-02-01), Gantley
patent: 4521995 (1985-06-01), Sekiya
patent: 4597228 (1986-07-01), Koyama et al.
patent: 4625463 (1986-12-01), Sekiya
patent: 4808046 (1989-02-01), Pilkington et al.
patent: 4808406 (1989-02-01), Brinkman
patent: 5029418 (1991-07-01), Bull
patent: 5203547 (1993-04-01), Marumo
patent: 5410791 (1995-05-01), Wirth et al.
patent: 5445559 (1995-08-01), Gale et al.
patent: 5451549 (1995-09-01), Oki et al.
patent: 5527744 (1996-06-01), Mignardi et al.
patent: 5605489 (1997-02-01), Gale et al.
patent: 5803797 (1998-09-01), Piper

Affiliated with

Also associated with

Rating

Method and apparatus to hold integrated circuit chips onto a chu does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus to hold integrated circuit chips onto a chu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus to hold integrated circuit chips onto a chu will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1901431