Semiconductor device manufacturing: process – With measuring or testing
Patent
1997-12-12
1999-06-15
Niebling, John F.
Semiconductor device manufacturing: process
With measuring or testing
438 15, 438 17, 438 18, 438460, 438462, A01L 2166, G01R 3126
Patent
active
059131047
ABSTRACT:
A cutting chuck for use with a cutting blade and for holding a semiconductor wafer in place during a dicing process and a die pick for picking the segmented semiconductor wafer from the chuck. The chuck includes a surface for supporting the wafer and several ports in the surface connected to a vacuum source. Preferably, the cutting chuck includes a housing having a base and a wall. A vacuum chamber is provided within the housing and on top of the base. A porous layer is located in housing and above the vacuum chamber. A surface layer is above the porous layer and contains ports connecting the surface supporting the wafer to the vacuum chamber via the porous layer. In a most preferred embodiment, the chuck is removeably attached to the vacuum source via a check valve. The cutting chuck may also include recesses in the surface to prevent impingement on the cutting chuck by a cutting blade during wafer dicing. The die pick includes a pick head having a surface for contacting the plurality of die sawn from a wafer. The surface includes a plurality of ports that are in fluid communication with a vacuum source. The die pick picks the plurality of die from the chuck for further processing.
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Heideman Donald M.
Keith Chris
Piper John G.
Villet Michael A.
Micro)n Technology, Inc.
Niebling John F.
Zaineke David A.
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