Package making – Methods – Filling preformed receptacle
Reexamination Certificate
2008-03-05
2011-12-06
Tawfik, Sameh H. (Department: 3721)
Package making
Methods
Filling preformed receptacle
C053S452000, C053S167000
Reexamination Certificate
active
08069636
ABSTRACT:
An improved adhesive-backed carrier tape system for packaging of components. Components or devices are held within the compartments of the carrier portion by a low tack adhesive level layer while a high tack adhesive layer is affixed to the carrier portion to provide means for high speed, low cost automated handling of the packaged components.
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Rozsa Thomas I.
Tawfik Sameh H.
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