Method and apparatus to detect capillary indentations

Television – Special applications – Manufacturing

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348126, 382146, H04N 718

Patent

active

056421583

ABSTRACT:
This invention provides a method and apparatus for automatically inspecting the connection of a wire to a lead on lead frame containing a semiconductor chip or similar device. Using an image processor to locate the general position of a soldered lead in a digitized image, the present invention creates a template of an idealized optical indentation left by a good bond; determines parameters such as wire angle, idealized position and shape thresholds for applying the template; conducts a normalized correlation search of the digitized image; compares the results returned to the parameters and reports the resulting signals generated by this comparison to a host controller or other control module.

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