Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating moving substrate
Reexamination Certificate
2007-04-17
2007-04-17
Wong, Edna (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating moving substrate
C205S137000, C205S146000, C205S224000, C205S093000
Reexamination Certificate
active
10744294
ABSTRACT:
The present invention provides a method for forming a conductive film with uniform properties on a wafer surface that has features or cavities. During the process, the workpiece is rotated and laterally moved while an electrodeposition solution is delivered onto the wafer surface at a predetermined flow rate, and a potential difference is applied between the workpiece surface and the electrode. The workpiece is rotated about an axis at predetermined revolutions per minute so that an edge region of the workpiece has a first predetermined linear velocity due to the rotation. The workpiece has a second predetermined linear velocity due to the lateral motion. The second predetermined velocity may be larger than the first predetermined velocity. Further, the wafer may not be rotated.
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Basol Bulent M.
Talieh Homayoun
Knobbe Martens Olson & Bear
Novellus Systems Inc.
Wong Edna
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