Method and apparatus to control device temperature

Data processing: generic control systems or specific application – Specific application – apparatus or process – Specific application of temperature responsive control system

Reexamination Certificate

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Details

C700S153000, C702S130000

Reexamination Certificate

active

06470238

ABSTRACT:

BACKGROUND
1. Field of the Invention
The field of the invention relates to temperature control of components, including memory devices.
2. Related Art
New generation chipsets dissipate a significant amount of power due to higher operating frequencies and large gate counts. A significant amount of the power dissipated by newer high speed chipsets is dissipated in the I/O buffers. The power dissipation is modulated by the quantity and the pattern of data driven out from the chip's I/O buffers. Increased power dissipation results in increased package and die temperatures and therefore may lead to system failure.
SUMMARY
In brief, one embodiment of the invention relates to an apparatus comprising a device and a controller coupled to the device. The controller controls access to the device by throttling access requests to the device.


REFERENCES:
patent: 5265099 (1993-11-01), Feinstein
patent: 5590061 (1996-12-01), Hollowell, II et al.
patent: 5721837 (1998-02-01), Kikinis et al.
patent: 5732215 (1998-03-01), Boutaghou et al.
patent: 5784328 (1998-07-01), Irrinki et al.
patent: 5798918 (1998-08-01), Georgiou et al.
patent: 5835885 (1998-11-01), Lin

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