Method and apparatus to add slurry to a polishing system

Details Method and apparatus to add slurry to a polishing system Method and apparatus to add slurry to a polishing system

2005-12-27

2005-12-27

Nguyen, George (Department: 3723)

Abrading

Abrading process

Abradant supplying

C451S288000, C451S398000, C451S446000

Reexamination Certificate

active

06979251

ABSTRACT:
A semiconductor wafer is wetted with slurry by injecting the slurry into at least one channel which is provided in a wear ring, while the wear ring is holding the wafer and is pressed against a polishing pad. Preferably, the channel in the wear ring includes a plurality of outlets, and the outlets provide that the slurry can exit the wear ring and contact the polishing pad. Providing that the wear ring includes at least one channel and that slurry is injected into the channel during the polishing process provides that slurry is introduced between the wear ring and the polishing pad and this greatly increases the amount of slurry getting to the wafer.

REFERENCES:
patent: 5695392 (1997-12-01), Kim
patent: 5902173 (1999-05-01), Tanaka
patent: 5931725 (1999-08-01), Inaba et al.
patent: 5944593 (1999-08-01), Chiu et al.
patent: 6241582 (2001-06-01), Lin et al.
patent: 6347979 (2002-02-01), Drill
patent: 6458020 (2002-10-01), Brigante et al.
patent: 6682409 (2004-01-01), Cheng

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