Plastic and nonmetallic article shaping or treating: processes – Forming continuous or indefinite length work – Layered – stratified traversely of length – or multiphase...
Patent
1980-10-30
1982-08-17
Thurlow, Jeffery R.
Plastic and nonmetallic article shaping or treating: processes
Forming continuous or indefinite length work
Layered, stratified traversely of length, or multiphase...
264514, 4251331, 425376A, 425462, B29F 306
Patent
active
043449077
ABSTRACT:
Disclosed is a method and apparatus for ensuring uniform distribution of higher and lower viscosity or flow rate resins in a product produced by a coextrusion process. A flow restriction is provided in the flow path of the lower viscosity or flow rate resin to increase the pressure drop of this resin as it passes through a coextrusion die. The increased pressure drop introduced by the flow restriction causes the lower viscosity or flow rate resin to be more uniformly distributed in the extruded product. A specific die construction providing a uniform resin flow channel within the die is also described.
REFERENCES:
patent: 2824337 (1958-02-01), Covington, Jr. et al.
patent: 2859476 (1958-11-01), Lainson
patent: 2978748 (1961-04-01), McCauley et al.
patent: 3365750 (1968-01-01), Donald
patent: 3419938 (1969-01-01), Sonia et al.
patent: 3555128 (1971-01-01), Schrenk
patent: 3694292 (1972-09-01), Schippers et al.
patent: 3737260 (1973-06-01), Kaye
patent: 4043739 (1977-08-01), Appel
patent: 4061461 (1977-12-01), Hessenthaler
patent: 4152387 (1979-05-01), Cloeren
Gilman Michael G.
Huggett Charles A.
Mobil Oil Corporation
O'Sullivan Sr. James P.
Thurlow Jeffery R.
LandOfFree
Method and apparatus providing uniform resin distribution in a c does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus providing uniform resin distribution in a c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus providing uniform resin distribution in a c will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-186512