Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1997-07-29
2000-05-09
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438106, 438107, H01L 2144, H01L 2148, H01L 2150
Patent
active
060603399
ABSTRACT:
A method and apparatus for repair of a multi-chip module such as a memory module is provided, where at least one redundant or auxiliary chip attach location is provided on the substrate of the multi-chip module. The auxiliary chip attach location preferably provides contacts for attachment of more than one type of replacement semiconductor chip. Accordingly, when one or more chips on the multi-chip module are found to be completely or partially defective, at least one replacement chip can be selected and attached to the auxiliary location to provide additional memory to bring the module back to its design capacity.
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Akram Salman
Hembree David R.
Wark James M.
Collins D. M.
Micro)n Technology, Inc.
Picardat Kevin M.
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