Method and apparatus of thermal detection using bonded coupon

Details Method and apparatus of thermal detection using bonded coupon Method and apparatus of thermal detection using bonded coupon

1982-08-31

1985-05-14

Stearns, Richard R.

Signals and indicators

Indicators

Temperature responsive or compensating means

374160, G01K 1106

Patent

active

045165203

ABSTRACT:
A coupon is bonded to a component using a bonding agent which is capable of withstanding temperatures only up to a selected temperature above which the bonding agent no longer holds the coupon to the component. The component, during an operation, is intended for exposure to temperatures not above the selected temperature. An exposure of the component to the elevated selected temperature is identified by the fact that the coupon is no longer bonded to the component after termination of the operation. When the component is provided with insulation, the selected temperature is chosen to correspond to a temperature at which the insulation fails to determine the integrity of the insulation after the insulation. The coupon may be bonded to an exterior or interior surface of the component. With an exterior bonded component, visual inspection is sufficient. With an interior bonded component, detection means such as ultrasonic instrumentation is utilized to determine the presence or absence of the bonded coupon.

REFERENCES:
patent: 2937527 (1960-05-01), Mason et al.
patent: 3451479 (1969-06-01), Parker
patent: 3518961 (1970-07-01), Kovac
patent: 3548992 (1970-12-01), Dawson
patent: 3733889 (1973-05-01), Proctor, Jr.
patent: 3845662 (1974-11-01), Surgina et al.
patent: 3994341 (1976-11-01), Anderson et al.
patent: 4056970 (1977-11-01), Sollish
patent: 4272988 (1981-06-01), Phillips et al.
patent: 4289088 (1981-09-01), Scibelli
patent: 4307612 (1981-12-01), Elsley et al.

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