Method and apparatus of printed circuit board assembly with opti

Electricity: electrical systems and devices – Miscellaneous

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2281802, 228 563, H05K 118

Patent

active

048519669

ABSTRACT:
Method and apparatus are disclosed for printed circuit board assembly wherein optimal placement of components are effected. Components, such as microminiature components, are placed, at least on the underside of the circuit board, whereby specially contoured solder pads effect a self-alignment of such components prior to their being affixed in place by a suitable adhesive material.

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