Method and apparatus of polishing wafer

Details Method and apparatus of polishing wafer Method and apparatus of polishing wafer

1997-07-22

1998-07-14

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

451285, 451286, 451287, 451288, 451289, B24B 1302

Patent

active

057795207

ABSTRACT:
The method and apparatus of polishing and post-processing a substrate by which the particle level after planarization of a semiconductor device by polishing may be reduced. According to the present invention, the substrate of the semiconductor device to be processed is maintained in a wet state since directly after polishing until the end of post-processing.

REFERENCES:
patent: 4050954 (1977-09-01), Basi
patent: 4116714 (1978-09-01), Basi
patent: 4680893 (1987-07-01), Cronkhite et al.
patent: 5299584 (1994-04-01), Miyazaki et al.
patent: 5320706 (1994-06-01), Blackwell
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5333413 (1994-08-01), Hashimoto
patent: 5361545 (1994-11-01), Nakamura
patent: 5375291 (1994-12-01), Tateyama et al.
patent: 5425793 (1995-06-01), Mori et al.
patent: 5487398 (1996-01-01), Ohmi et al.
patent: 5498199 (1996-03-01), Karlsrud
Japanese Abstract, Application 64-282372, Cleaning Device for Substrate, Katsumi Umeda, Jun. 18, 1991.

Affiliated with

Also associated with

Rating

Method and apparatus of polishing wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus of polishing wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus of polishing wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1876428