Method and apparatus of changing PCB pad structure to...

Details Method and apparatus of changing PCB pad structure to... Method and apparatus of changing PCB pad structure to...

2011-04-19

2011-04-19

Chen, Xiaoliang (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S749000, C361S760000, C174S263000, C174S267000, C029S843000

Reexamination Certificate

active

07929314

ABSTRACT:
The present disclosure is directed at an apparatus for changing printed circuit board pad structure to increase solder volume and strength. The invention provides increased end row pad and lead size and utilizes a plurality of lead-to-pad and pad-to-lead conforming geometric structures to form a joint providing additional solder surface adhesion area.

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patent: 7013564 (2006-03-01), Shimokawa et al.
patent: 7087846 (2006-08-01), Alcoe
patent: 2007/0045812 (2007-03-01), Heng
patent: 2008/0036079 (2008-02-01), Chen et al.
patent: 2007294916 (2007-11-01), None

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