Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1981-07-16
1985-04-23
Wityshyn, Michael
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
118209, 118220, 118226, 144352, 1563043, 156546, 156558, 156559, 156578, B32B 3112, B32B 3120
Patent
active
045128405
ABSTRACT:
A machine for assembling wood flooring intermittently advances rows of wood fillets lengthwise along side-by-side paths. Glue is applied to opposed longitudinal sides of the fillets in adjacent rows, and a strip of compressible material is inserted between the glue-bearing fillet surfaces. The rows converge and the fillets are pressed together to join the fillets and the cushion material. The pressing preferably occurs at a station where glue is simultaneously applied to other rows of fillets. Each glue applicator has an outwardly-directed face for applying glue to the fillets as they slide by the face, and the face is apertured with a recess which contains glue supplied from a pressured source.
REFERENCES:
patent: 1756583 (1930-04-01), Cadwallader
patent: 1890954 (1932-12-01), Snyder
patent: 1913290 (1933-06-01), Rockwell
patent: 2026511 (1935-12-01), Storm
patent: 2277892 (1942-03-01), Swenson
patent: 2516280 (1950-07-01), Welch
patent: 2642835 (1953-06-01), Winkel
patent: 3322593 (1967-05-01), Conti
patent: 3334557 (1967-08-01), Fitzgibbon
patent: 3365850 (1968-01-01), Marino
patent: 3579941 (1971-05-01), Tibbals
patent: 3629986 (1971-12-01), Klittich
patent: 3682751 (1972-08-01), Gebhardt et al.
patent: 4050206 (1977-09-01), Utsuyama
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