Method and apparatus for wirebonding

Details Method and apparatus for wirebonding Method and apparatus for wirebonding

1992-11-12

1993-12-14

Heinrich, Samuel M.

Metal fusion bonding

With means to handle work or product

Including means to orient work or position work portion...

228102, H01L 21603

Patent

active

052694526

ABSTRACT:
A method and apparatus for wirebonding is provided. The apparatus is operable to perform a method of wirebonding leadwires between bond pads of a die of an integrated circuit (IC) and contacts of a leadframe of a IC package, in which the resulting bonded leadwires fan out towards corners of the package, and in which the sequence of formation of wirebonds is selected to minimize wirebonding tool-to-wire interference. In wirebonding a high lead count integrated circuit die to a leadframe of a package in which bonded leadwires fan out at angles approaching 45.degree. near corners of the package, for example as in a quad flat pack (QFP) format, bonding proceeds in sequence along each side to provide bonded leadwires to bond pads in a direction from a corner towards an intermediate position along one side and then from the opposite corner towards the intermediate position, in a direction of decreasing fan out angle. Thus, a previously bonded leadwire is angled away from an adjacent bond pad to which a subsequent leadwire is to be bonded, and access of the bonding tool to an adjacent pad is independent of fan out angle.

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