Method and apparatus for wire bonding

Details Method and apparatus for wire bonding Method and apparatus for wire bonding

1989-11-28

1991-08-06

Heinrich, Samuel M.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228179, 228 45, 228 7, B23K10136, H01L 2160, H01L 2348

Patent

active

050370235

ABSTRACT:
The present invention relates to a ball bonding technique using an insulated wire in assembling a semiconductor chip in which the ball is formed at the end of an insulated wire by an electrical discharge and the insulation at a portion of the wire to be bonded a predetermined distance from one end of the wire is removed by an electrical discharge.

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