Method and apparatus for wire bonding

Details Method and apparatus for wire bonding Method and apparatus for wire bonding

1991-04-29

1992-05-05

Heinrich, Samuel M.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228179, 219 5621, 219497, B23K 3100, H05K 332

Patent

active

051100320

ABSTRACT:
The present invention relates to a ball bonding technique using an insulated wire in assembling a semiconductor chip in which the ball is formed at the end of an insulated wire by an electrical discharge and the insulation at a portion of the wire to be bonded a predetermined distance from one end of the wire is removed by an electrical discharge.

REFERENCES:
patent: 4476366 (1984-10-01), Kurtz et al.
patent: 4950866 (1990-08-01), Kojima et al.

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