Metal fusion bonding – Process – Plural joints
Patent
1996-08-02
1998-08-11
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228 45, H01L 2160
Patent
active
057915504
ABSTRACT:
So as to prevent improper wire feeding, a vibration applying device such as an electromagnetic means, etc., is provided which applies a vibration to a spool when the spool is rotated in order to feed out a wire from the spool.
REFERENCES:
patent: 4019669 (1977-04-01), Tanimoto et al.
patent: 5031821 (1991-07-01), Kaneda et al.
Heinrich Samuel M.
Shinkawa U.S.A. Incorporated
LandOfFree
Method and apparatus for wire bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for wire bonding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for wire bonding will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-380654