Method and apparatus for wire bond

Details Method and apparatus for wire bond Method and apparatus for wire bond

1992-02-18

1993-01-05

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228 45, H01L 2160

Patent

active

051763109

ABSTRACT:
The present invention relates to a ball bonding technique using an insulated wire in assembling a semiconductor chip in which the ball is formed at the end of an insulated wire by an electrical discharge and the insulation at a portion of the wire to be bonded a predetermined distance from one end of the wire is removed by an electrical discharge.

REFERENCES:
patent: 4998002 (1991-03-01), Okikawa et al.
patent: 5095187 (1992-03-01), Gliga

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