Method and apparatus for wet-cleaning substrate

Cleaning and liquid contact with solids – Apparatus – Automatic controls

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C134S103200, C134S184000, C134S186000, C436S039000, C436S055000, C073S073000, C073S075000, C236S04400R, C236S049100

Reexamination Certificate

active

06938626

ABSTRACT:
An apparatus for wet cleaning a substrate includes a clean air supplier for supplying the clean air into a cleaning draft, a humidifier for supplying steam or mist like water drops into the cleaning draft, a hygrometer, connected to the humidifier and positioned at the level of the cleaning solution, an exhaust piping and an exhaust rate control means.

REFERENCES:
patent: 5472516 (1995-12-01), Hanson et al.
patent: 5976988 (1999-11-01), Konuma et al.
patent: 6092539 (2000-07-01), Chang et al.
patent: 6261845 (2001-07-01), Verhaverbeke et al.
patent: 198 40 989 (1999-03-01), None
patent: 56000214 (1981-01-01), None
patent: 63-151028 (1988-06-01), None
patent: 8-334461 (1996-12-01), None
patent: 9022891 (1997-01-01), None
patent: 98/56726 (1998-12-01), None
patent: 01/39262 (2001-05-01), None
Kashkoush et al: In-Situ Chemical Concentration Control for Wafer Wet Cleaning, Journal of the IEST, Mont Prospect, IL, US vol. 41, No. 3 May 1998, pp. 24-30 XP000957413.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for wet-cleaning substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for wet-cleaning substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for wet-cleaning substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3392720

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.