Method and apparatus for wafer marking

Details Method and apparatus for wafer marking Method and apparatus for wafer marking

2008-06-20

2010-06-15

Mandala, Victor A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Alignment marks

C414S222010, C414S806000, C438S014000, C438S975000, C257SE23179

Reexamination Certificate

active

07737567

ABSTRACT:
A semiconductor substrate is provided. The substrate includes a first surface and an opposing second surface, wherein the first surface includes a marking in a centroid region of the first surface. The marking indicates a location of a center point on the first surface of the semiconductor substrate or identification data unique to the substrate. A system, methods of transporting and marking, and a device for reading the substrate markings are also provided.

REFERENCES:
patent: 5966201 (1999-10-01), Shiraishi et al.
patent: 6973370 (2005-12-01), Ito et al.
patent: 08172033 (1996-07-01), None

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