Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-02-23
1998-06-23
Aftergut, Jeff H.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
148DIG12, 148DIG135, 148DIG159, 156281, 437225, 437974, H01L 21304
Patent
active
057699917
ABSTRACT:
A method of wafer bonding with less elongation and contraction of wafers at the time of and after the bonding of the wafers is disclosed. In the method of wafer bonding, wafers are bonded together with sticking force of their surfaces to form a bonded wafer. The bonding is done by selecting the pressure of the gas between the wafers to be lower than the atmospheric pressure, for instance, and also selecting the kind of gas between the wafers to H.sub.2, for instance.
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Miyazawa Yoshihiro
Ohkubo Yasunori
Aftergut Jeff H.
Kananen Ronald P.
Sony Corporation
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