Optics: measuring and testing – By polarized light examination – With light attenuation
Patent
1999-05-12
2000-08-15
Font, Frank G.
Optics: measuring and testing
By polarized light examination
With light attenuation
356372, 356380, 356376, F01B 1128
Patent
active
061044938
ABSTRACT:
The bump height is measure din a sample area on a wafer, the bump height distribution on the wafer is estimated on the bases of the measured value, the portion where the estimated height distribution is out of a predetermined range is determined as an inspection area, and the bump height is measured in the inspection area, and a chip area having a bump height out of a predetermined range is judged to be defective. Data of the inspection areas and inspection results are accumulated, and the inspection density is renewed on the basis of the accumulated data. In another method, the inspection area is divided into rectangular blocks so that each block has a width of approximately equal to a light beam scanning length and a distance between any adjacent bumps in the feeding direction is less than a predetermined value, feeding path being perpendicular to the scanning direction. Block feed time and between-block feed time are calculated, a whole feeding path whose total feed time of the block and between-block feed time are minimum is found, and bump height is measured with receiving reflected light from the bump while feeding along the found feeding path.
REFERENCES:
patent: 5159643 (1992-10-01), Kaga et al.
patent: 5307292 (1994-04-01), Brown et al.
Fuse Takashi
Nishiyama Youji
Oshima Yoshitaka
Takahashi Fumiyuki
Tsukahara Hiroyuki
Font Frank G.
Fujitsu Limited
Ratliff Reginald A.
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