Method and apparatus for vapor phase soldering

Drying and gas or vapor contact with solids – Apparatus – With means to treat gas or vapor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

34242, F26B 1512

Patent

active

047666773

ABSTRACT:
A system is provided for vapor phase soldering of articles, in a hot vapor, in which the articles are preheated prior to being delivered to a vapor zone, to raise the temperature of the wires or other contact points that are to be soldered together, to be compatible. Techniques are employed to prevent escape of the soldering vapor, including controlled opening of inlet and outlet closures to the system, sloped inlet and outlet tunnels, heated inlet and outlet zones, the condensation of vapor at transition locations and an air screen or air shield system just inside the openable closures to the system. A control of the locations of condensation of the vapors is provided, with delivery of the condensate for re-use. A condensate flash tray is provided in the system for substantially immediate re-vaporization of some of the condensate. An electric fluid boil system and a still are provided. A conveying system is provided for delivering articles into, through and out of the vapor zone, from positions above the vapor line, through the vapor, and back above the vapor line upon discharge.

REFERENCES:
patent: Re30399 (1980-09-01), Ammann
patent: 872257 (1907-11-01), Schicht
patent: 2723448 (1955-11-01), Miller
patent: 2842841 (1958-07-01), Schnable
patent: 2844867 (1958-07-01), Wernz
patent: 3000346 (1961-09-01), Hnilicka, Jr.
patent: 3080648 (1963-12-01), Thomas
patent: 3263325 (1966-08-01), Jacobson
patent: 3375177 (1968-03-01), Rand
patent: 3408748 (1968-11-01), Dunn, Jr.
patent: 3409978 (1968-12-01), Raciti
patent: 3482755 (1969-12-01), Raciti
patent: 3656492 (1972-04-01), Holm
patent: 3686746 (1972-08-01), Gwyn, Jr.
patent: 3825164 (1974-07-01), Sarnacki
patent: 3866307 (1975-02-01), Pfahl, Jr.
patent: 3904102 (1975-09-01), Chu
patent: 3947240 (1976-03-01), Pfahl, Jr.
patent: 3977075 (1976-08-01), Lynch
patent: 3996949 (1976-12-01), Boynton
patent: 4032033 (1977-06-01), Chu
patent: 4055217 (1976-08-01), Chu
patent: 4077467 (1978-03-01), Spigarelli
patent: 4090843 (1978-05-01), Chu
patent: 4115601 (1978-09-01), Ammann
patent: 4146166 (1979-03-01), Bankes
patent: 4150494 (1979-04-01), Rothchild
patent: 4187974 (1980-02-01), Mahajan
patent: 4194297 (1980-03-01), Pfahl, Jr.
patent: 4234118 (1983-04-01), Bankes
patent: 4238186 (1980-12-01), Pfahl, Jr.
patent: 4244505 (1981-01-01), Stokes, Jr.
patent: 4256512 (1981-03-01), Ammann
patent: 4264299 (1981-04-01), Ammann
patent: 4277518 (1981-07-01), Schillke
patent: 4315042 (1982-02-01), Spigarelli
patent: 4348174 (1982-09-01), Spigarelli
patent: 4373658 (1983-02-01), March
patent: 4378296 (1983-08-01), Carlson, Jr.
patent: 4380431 (1983-04-01), Carlson, Jr.
patent: 4389797 (1983-06-01), Spigarelli
patent: 4403949 (1983-09-01), March
patent: 4538363 (1985-09-01), Zagaroff
Product brochure, "Phase-Four Production Systems for Vapor Phase Soldering", HTC.
Product brochure, "Phase-Four Model IL-12", HTC, 1983.
Advertisement, "Facts you can use in your surface mount soldering", Hollis Automation, Inc., 1985.
Product brochure, "Mannix Vapor Phase & Infra-Red Reflow Soldering Systems", Henry Mann, Inc., 1984.
Product brochure, "SMT Vapor Soldering System-Model CUPSS-1", Centech Corp., 6/84.
"Vapor Phase Soldering", Journal of Metals, Jun. 1977, pp. 22 and 23.
"Condensation/Vapor-Phase Reflow Soldering", Assembly Engineering, Jun. 3, 1977, pp. 44-47.
"Hot Vapor Cures a Tough Solder Headache", Automation, Dec. 1976, pp. 5 and 6.
"Vapor Phase Fusion and Reflow for PC's", PC Traces, Apr. 1975, pp. 85 and 86.
"Vapor-Phase Reflow: Condensing Vapor Does the Trick--Quick", Circuits Manufacturing, Jun. 1975, p. 24.
"Vapor-Phase Process Insures Quality Control for Difficult Soldering Operations", LEAD, vol. 40, No. 1-2, 1977.
"Vapor Phase Solder Reflow for Hybrid Circuit Manufacturing", Solid State Technology, vol. 19, No. 10, pp. 50-53.
"Vapor Phase Solder Reflow", Production Machines, p. 58.
"Vapor Phase Solder Reflow", California Circuit Association, Oct. 1975.
Sales brochure, "Fluorinert Brand Electronic Liquids", 3M Company.
Dingman, "Solvent Vapor Solder Reflow", IBM Technical Disclosure Bulletin, vol. 13, No. 3, 8-1970, p. 639.
"Condensation Soldering: A New Mass Soldering Process", from The Western Electric Engineer, Apr. 1975.
"Condensation Soldering with Vapor Blanket Reduces Cost of This High Yield, High Quality Process", by T. Y. Chu et al.
"Residue Removal Methods for Condensation Soldering Systems", by P. F. Lilienthal, G. M. Wenger, F. M. Zado.
"Reprint from Electronic Packaging and Production", Jul. 1976, entitled Understanding Fluorocarbons, p. 78, by M. S. Kiver Publications.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for vapor phase soldering does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for vapor phase soldering, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for vapor phase soldering will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2080570

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.