Method and apparatus for vacuum diode heat pump

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

62 31, 622592, 378 4, F28D 1500

Patent

active

060893117

ABSTRACT:
A new use for thermionic vacuum diode technology is disclosed wherein a vacuum diode is constructed using very low work function electrodes. A negative potential bias is applied to the cathode relative to the anode, and electrons are emitted. In the process of emission the electrons carry off kinetic energy, carrying heat away from the cathode and dissipating it at an opposing anode. The resulting heat pump is more efficient than conventional cooling methods, as well as being substantially scalable over a wide range of applications. Fabrication using conventional microelectronic fabrication techniques is possible.

REFERENCES:
patent: 4004210 (1977-01-01), Yater
patent: 4463798 (1984-08-01), Pogson et al.
patent: 4819011 (1989-04-01), Yokota
patent: 5040381 (1991-08-01), Hazen
patent: 5305363 (1994-04-01), Burke et al.
patent: 5356484 (1994-10-01), Yater
patent: 5699668 (1997-12-01), Cox
Kumar et al., Diamond-based Field Emission Flat Panel Displays, Solid Stte Technology, pp. 71-72, May 1995.
Yater, Physical Review A, vol. 26, No. 1, Physical basis of power conversion of Energy Fluctuations, pp. 523-538, Jul. 1982.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for vacuum diode heat pump does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for vacuum diode heat pump, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for vacuum diode heat pump will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2026340

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.