Method and apparatus for utilizing acoustic coaxing induced micr

Details Method and apparatus for utilizing acoustic coaxing induced micr Method and apparatus for utilizing acoustic coaxing induced micr

1996-06-19

1997-10-28

Warden, Jill

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134184, 134902, B08B 312

Patent

active

056813961

ABSTRACT:
The invention relates to the surgical cleaning of a semiconductor wafer through the inducement of cavitation on the surface of the wafer at the location of an adherent particle. Cavitation is induced by focusing two acoustic fields on the surface of the wafer. The two acoustic fields include a cavitation field having relatively low frequency focused on the wafer surface from a direction perpendicular to the wafer and a coaxing field of relatively high frequency focused on the wafer surface form a direction between 0 and 25 degrees from the wafer surface.

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Berg, D.M. et al., (1989) "New Sonic Cleaning Technology for Particle Removal From Semiconductor Surfaces" Particles on Surfaces-2: Detection, Adhesion and Removal from Semiconductor Surfaces Ed. K.L. Mittal, Plenum Press, New York.

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