Method and apparatus for using light emitting diodes for the...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure

Reexamination Certificate

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Details

C257S276000, C257S625000, C257S675000, C257S706000, C257S720000, C257SE23101

Reexamination Certificate

active

07863641

ABSTRACT:
The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the “p-n” junction.

REFERENCES:
patent: 5631987 (1997-05-01), Lasky et al.
patent: 5729561 (1998-03-01), Hironaka
patent: 7345320 (2008-03-01), Dahm
patent: 2001/0046652 (2001-11-01), Ostler et al.

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