Method and apparatus for using desoldering material

Details Method and apparatus for using desoldering material Method and apparatus for using desoldering material

1991-01-31

1991-12-17

Heinrich, Samuel M.

Metal fusion bonding

Process of disassembling bonded surfaces, per se

228 19, B23K 300

Patent

active

050728741

ABSTRACT:
A desoldering material with an opening or window shaped so that the base of an electronic component can fit inside the opening while the desoldering material simultaneously contacts all solder joints which bond the component's outer leads to pads on a surface. A first adhesive secures the base to the surface, a second adhesive secures a retraction device to the base, the first adhesive is heated and softened without softening the second adhesive, and the retraction device removes the desoldered component from the surface. The invention is well suited to removing tape-automated-bonded integrated circuits adhesively attached to high density multichip module substrates.

REFERENCES:
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patent: 3751799 (1973-08-01), Reynolds
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Letter from Jim Bell to Ying-kit Lau, dated Oct. 2, 1990.
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Letter from Brian Duffy to James Johnson, dated Sep. 24, 1987.
IBM Technical Disclosure Bulletin, "Solder Wick", vol. 13, No. 2, p. 445 (Jul. 1970).
IBM Technical Disclosure Bulletin, "Desoldering Unit", vol. 21, No. 11, p. 4482 (Apr. 1979).

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