Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-06-27
2006-06-27
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S691000, C257S723000, C257S777000, C438S108000, C438S109000
Reexamination Certificate
active
07067910
ABSTRACT:
One embodiment of the present invention provides a technique for assembling semiconductor chips. First, multiple semiconductor chips are permanently laminated together into a plurality of laminated chip assemblies, wherein the semiconductor chips within the laminated chip assembly communicate with each other through electrically conductive connections. Next, laminated chip assemblies are stacked together to form a stack of semiconductor chips without permanently bonding the laminated chip assemblies together, wherein the laminated chip assemblies communicate with each other using capacitive coupling.
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Drost Robert J.
Ho Ronald
Zingher Arthur R.
Nelms David
Park Vaughan & Fleming LLP
SUN Microsystems Inc.
Taylor Earl
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