Method and apparatus for uniformly debossing and aperturing a re

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156252, 156290, 156293, 428133, 428137, 428161, 428178, 430323, 604370, A61F 1316, B31F 100, B32F 3100

Patent

active

044419520

ABSTRACT:
Method for constructing a forming structure for imparting a uniformly apertured three-dimensional pattern to a heated plastic material subjected to a fluid pressure differential while in contact with said forming structure. In a preferred embodiment, said forming structure is created by forming a substantially continuous pattern of apertures in a multiplicity of planar sheets, at least a portion of said sheets having aperture patterns which are concentrically aligned but dissimilar in size to one another. The sheets having said concentrically aligned aperture patterns are thereafter superposed upon one another and bonded together at contact points so as to form a stack exhibiting a three-dimensional continuum of capillary networks. A sufficient number of laminae are employed to ensure that said networks are of greater overall thickness than the maximum depth to which the plastic film is drawn when subjected to said fluid pressure differential. Said capillary networks exhibit a cross sectional area which reaches a minimum intermediate the uppermost and lowermost surfaces of the stack and thereafter increases in the direction of the lowermost surface of the stack. The laminate forming structure is preferably caused to assume a tubular shape and its opposing free edges are secured to one another without disrupting the three-dimensional continuum of capillary networks along its periphery.

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