Cutting – Processes – Cut advances across work surface
Patent
1992-02-20
1994-06-07
Bilinsky, Z. R.
Cutting
Processes
Cut advances across work surface
83100, 83577, 409132, B23C 300, B27C 502
Patent
active
053179439
ABSTRACT:
A method and apparatus for cutting mat board, and more specifically for cutting apertures including non-linear boundaries in mat board. The preferred embodiment of the apparatus of the present invention includes an automatically controlled ultrasonic cutting tool for cutting apertures having bevelled boundaries according to a predetermined pattern. The preferred embodiment of the method of the present invention includes stacking first and second mat boards and cutting through said first board into but not through said second, removing said first board, and cutting the same aperture in the same location in said second mat board which has been stacked on a third, uncut mat board.
REFERENCES:
patent: 3413893 (1968-12-01), Wilson
patent: 3580136 (1971-05-01), Bodine
patent: 3967519 (1976-07-01), Esterly
patent: 3996827 (1976-12-01), Logan
patent: 4158977 (1979-06-01), Logan
patent: 4158987 (1979-06-01), Smith
patent: 4178820 (1979-12-01), Gerber
patent: 4244669 (1981-01-01), Puritz, et al.
patent: 4413542 (1983-11-01), Rempel
patent: 4440055 (1984-04-01), Gelfand
patent: 4505174 (1985-03-01), Carithers, Jr.
patent: 4561814 (1985-12-01), Dahlgren, Jr. et al.
patent: 4567797 (1986-02-01), Folk
patent: 4590834 (1986-05-01), Sobel
patent: 4596171 (1986-06-01), Gerber
patent: 4641556 (1987-02-01), Vigneron et al.
patent: 4662258 (1987-05-01), Mood
patent: 4685366 (1987-08-01), Beder
patent: 4747330 (1988-05-01), Carithers, Jr.
patent: 4798112 (1989-01-01), Kozyrski et al.
patent: 4822219 (1989-04-01), Wood et al.
patent: 4833764 (1989-05-01), Muller
patent: 4834595 (1989-05-01), Cacciotti
patent: 5014584 (1991-05-01), Kozyrski et al.
Bilinsky Z. R.
Dowdle Burton K.
Dowdle Robert K.
LandOfFree
Method and apparatus for ultrasonically cutting mat board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for ultrasonically cutting mat board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for ultrasonically cutting mat board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-785874