Method and apparatus for ultrasonic scanning of a...

Measuring and testing – Vibration – By mechanical waves

Reexamination Certificate

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C073S618000, C073S622000

Reexamination Certificate

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07661315

ABSTRACT:
A method and apparatus for ultrasonic scanning of a wafer assembly is disclosed. The wafer assembly is held in a wafer chuck and rotated. A transducer generates ultrasound in the wafer assembly and the ultrasound emitted from the wafer assembly is sensed. A controller adjusts the relative positions of the wafer and the transducer and controls the transducer to generate ultrasound at a number of scan points.

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