Method and apparatus for ultrasonic bonding

Details Method and apparatus for ultrasonic bonding Method and apparatus for ultrasonic bonding

1981-09-10

1983-02-15

Wityshyn, Michael G.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

29407, 156 61, 156 732, 156378, 1565801, 228110, 228 1R, 228 565, B23K 2102

Patent

active

043736530

ABSTRACT:
A method and apparatus for providing high reliability ultrasonic bonds by monitoring the force required to separate the bonding tool from the wire after the bonding operation. This force which is required to break an incidental bond between the tool and the wire is related to the quality of the primary bond of the wire to a conductor terminal. The output of a transducer is proportional to the force and it may be coupled to a visual display, alarm, or computer for trend analysis.

REFERENCES:
patent: 3302277 (1967-02-01), Pruden et al.
patent: 3458921 (1969-08-01), Christensen
patent: 3763545 (1973-10-01), Spanjer
patent: 3794236 (1974-02-01), Salzer et al.
patent: 3827619 (1974-08-01), Cusick et al.
patent: 4040885 (1977-08-01), Hight et al.

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