Method and apparatus for treating exhaust gases from CVD, PECVD

Coating apparatus – Gas or vapor deposition

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118724, 553851, 553852, 554344, 55440, 55442, 55443, 156345, L23C 1600

Patent

active

059284269

ABSTRACT:
A method and apparatus for removing gas species which can be deposited thermally from a semiconductor process exhaust gas is provided. To treat the exhaust gas, an exhaust gas reactor comprising an artificial substrate which is heated is used. The artificial substrate is a structure upon which high temperature chemical vapor deposition (HTCVD) reaction product is deposited. In particular, the HTCVD reaction product is deposited by contacting the exhaust gas with the heated artificial substrate.

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