Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Reexamination Certificate
2006-01-03
2006-01-03
Carrilo, Sharidan (Department: 1746)
Cleaning and liquid contact with solids
Processes
For metallic, siliceous, or calcareous basework, including...
C134S001000, C134S001100, C134S001200, C134S001300, C134S002000, C134S019000, C134S021000, C134S024000, C134S026000, C134S028000, C134S030000, C134S034000, C134S035000, C134S036000, C134S037000, C134S041000, C134S042000, C134S902000
Reexamination Certificate
active
06982006
ABSTRACT:
A general method and apparatus for treating materials at high speed comprises the steps of dissolving a relatively high concentration ozone gas in a solvent at a relatively low predetermined temperature T1to form an ozone-solvent solution with a relatively high dissolved ozone concentration, and heating either the ozone-water solution or the material to be treated or both, the ozone-solvent solution and the material to be oxidized with a point-of-use heater to quickly increase the temperature to a predetermined higher temperature T2>T1, and applying the ozone-solvent solution to said material(s) whereby the heated ozone-water solution will have a much higher dissolved ozone concentration at said higher temperature, than could be achieved if the ozone gas was initially dissolved in water at said higher temperature.
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The Effect of Temperature on an Ozonated Water Photoresist Strip Process by Nelson et al.
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Bergman, E.; Castle, H.; Melli, M.; Magrin, M. “Photoresist Strip Process Using Ozone diffusion Through a Controlled Aqueous Boundary Layer,” Electronic Meeting Abstract of paper to be presented at Sixth International Symposium on Cleaning Technology inSemiconductor Device Manufacturing at the 1999 Joint International Meeting of the Electrochemical Society in Honolulu, Hawaii; Jul. 1, 1999.
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De Gendt, S.; Lux, M.; Claes, M.; Jassal, A.S.; Van Hoeymissen, J.; Lagrange, S.; Bergman, E.; Mertens, P.W.; and Heyns, M.M. “Evaluation of Ozonated Water Spray for Resist Cleaning Applications,” presented on Oct. 20th at the Sixth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing at the 1999 Joint International Meeting of the Electrochemical Society in Honolulu, Hawaii, Published in Cleaning Technology in Semiconductor Device Manufacturing VI, R.E. Novak,, J. Ruzyllo, and T. Hattori, Editors, The Electrochemical Society Proceedings Series, vol. 99-36, Pennington. NJ, May. 23, 2000, pp. 391-398.
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Boyers David G.
Cremer, Jr. Jay Theodore
Carrilo Sharidan
Smith Joseph
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