Method and apparatus for translating detected wafer defect...

Details Method and apparatus for translating detected wafer defect... Method and apparatus for translating detected wafer defect...

2005-04-19

2005-04-19

Niebling, John F. (Department: 2812)

Image analysis

Applications

Manufacturing or product inspection

C250S307000

Reexamination Certificate

active

06882745

ABSTRACT:
Systems and methods are described for translating detected wafer defect coordinates to reticle coordinates using CAD data. A wafer inspection image is provided and coordinates of potential defects in the wafer are determined. Then the wafer inspection image is converted into a predetermined image format. CAD data for the device under test is then used to produce a second image, also in the predetermined image format. The CAD-derived image and the wafer-derived image are then aligned, and the coordinates of potential defects in the wafer are converted into CAD coordinates. The CAD coordinates are then used to navigate through the reticle for the wafer in order to locate reticle defects corresponding to the detected wafer defects.

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Baker and Matthews, “Equivalence and efficiency of image alignment algorithms,”Proceedings of the 2001 IEEE Conference on Computer Vision and Pattern Recognition, 2001.
Jepson et al., “Robust online appearance models for visual tracking,”IEEE Conference on Computer Vision and Pattern Recognition, 1:415-422, 2001.

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