Method and apparatus for transferring substrate

Details Method and apparatus for transferring substrate Method and apparatus for transferring substrate

2005-12-27

2005-12-27

Crawford, Gene O. (Department: 3651)

Material or article handling

Associated with semiconductor wafer handling

C414S937000, C414S941000

Reexamination Certificate

active

06979168

ABSTRACT:
Bays100, 200, 300. . . are connected to an inter-bay transfer line400via bay stockers130, 230, 330. . . , respectively. The bay100is, in this embodiment, composed of a single wafer transfer line120having a looped planar shape and processing equipments101–106arranged side by side along the longitudinal transfer direction of the transfer line (direction crossing the transfer direction of inter-bay transfer line400). Processing equipments101–103are arranged side by side along one side of the transfer line120, and the remaining processing equipments104–106are arranged side by side along the other side of the transfer line120. The processing equipments101–106are equipped with transfer robots11–16, respectively. Moreover, processing equipments101–106are each equipped with a chamber (not shown) for processing wafers W one by one (single wafer processing chamber).

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