Metal fusion bonding – Process – Using high frequency vibratory energy
Patent
1991-09-30
1993-02-16
Heinrich, Samuel M.
Metal fusion bonding
Process
Using high frequency vibratory energy
228179, 228 11, 228 45, 1565801, B23K 2010, H01L 21607
Patent
active
051863782
ABSTRACT:
An apparatus (10) and method is provided for bonding wire (12) to the bond sites (28) of integrated circuits. In preferred embodiments gold wire (12) is bonded to aluminum bond pad (28). Apparatus (10) includes a high frequency ultrasonic energy source (20) designed to provide ultrasonic energy at frequencies above about 100 kHz causing the interface temperature required for adequate bonding to be greatly reduced. Heating element (19) applies thermal energy to interface (32) via capillary (16) and transducer (18). Therefore, according to the invention, less thermal energy is required from heater block (22) which is heating interface (32) via IC (14) and leadframe (15). In this fashion, leadframe (15) is maintained at a lesser temperature than in the prior art. Since leadframe (15) is at a lesser temperature, it can be plated with a material having a lower melting point (e.g. tin or solder). In preferred embodiments, leadframe (15) is substantially plated with tin (melting point 185.degree. C.) and maintained at about 165.degree. C. Interface (32) is maintained at about 180.degree. C. by thermal energy from heating element (19) (during the bonding process). In preferred embodiments capillary (16) is substantially made of beryllium oxide for adequate thermal conductivity.
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Texas Instruments Process Automation Center Brochure for ABACUS IIISE Wire Bonder Copyright 1991.
Barndt B. Peter
Brady III W. James
Donaldson Richard L.
Heinrich Samuel M.
Texas Instruments Incorporated
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