Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-05-20
2008-05-20
Dinh, Tuan T. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S777000, C361S778000
Reexamination Certificate
active
10746595
ABSTRACT:
Some embodiments of the invention effectively shield signal traces on a substrate without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of the invention provide improved power delivery without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of the invention are described in the claims.
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patent: 5500555 (1996-03-01), Ley
patent: 5616952 (1997-04-01), Nakano et al.
patent: 6008532 (1999-12-01), Carichner
patent: 6054767 (2000-04-01), Chia et al.
patent: 6538336 (2003-03-01), Secker et al.
Conner John
Nickerson Robert
Taggart Brian
Dinh Tuan T.
Intel Corporation
Marger Johnson & McCollom PC
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