Method and apparatus for through hole substrate printing

Coating apparatus – Work holders – or handling devices

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Details

118 50, 118704, 118706, 427 97, 101114, B05C 1300

Patent

active

053225651

ABSTRACT:
A method and apparatus are disclosed for enabling automated printing of through holes extending between top and bottom surfaces of a ceramic substrate or the like. The perimeter of the substrate is placed on a support that locates the bottom surface of the substrate spaced from a member that interacts with the interior portion of the substrate. The interacting member has holes that correspond to the through holes in the substrate, and it is moved generally perpendicular to the substrate to a position where it is in juxtaposition with the bottom surface of the substrate and its holes are in registration with the holes in the substrate. Conductive material is applied to the top surface of the substrate and a vacuum is applied to the holes in the interacting member to pull the conductive material through the through holes in the substrate. The vacuum is then discontinued and the interacting member is moved back to a position where it is spaced from the bottom surface of the substrate.

REFERENCES:
patent: 4293377 (1981-10-01), Miyajima
patent: 4323593 (1982-04-01), Tsunashima
patent: 4492180 (1985-01-01), Martin
patent: 4559718 (1985-12-01), Tadohoro
patent: 4655162 (1987-04-01), Kameyama
patent: 4710395 (1987-12-01), Young
patent: 4817556 (1989-04-01), Mears et al.

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