Method and apparatus for through hole substrate printing

Details Method and apparatus for through hole substrate printing Method and apparatus for through hole substrate printing

1986-05-14

1987-12-01

Smith, John D.

Coating processes

Measuring, testing, or indicating

427 97, 427294, H05K 312

Patent

active

047103957

ABSTRACT:
A method and apparatus for printing through holes in ceramic substrates and the like. The substrate is held in position by means of a vacuum applied to an outer peripheral surface portion thereof. The deposited substance is pulled through the holes in the substrate by means of a closely regulated vacuum applied only to an inner surface portion, the inner and outer vacuum areas being separated in a holder device by means of O-rings. A pressure-time profile which appears in a plenum closely adjacent to the inner chamber may be compared to a previously generated pressure-time profile reference and used to accept or reject parts.

REFERENCES:
patent: 3357856 (1967-12-01), Ragan
patent: 3604391 (1971-09-01), Mallia
patent: 4278706 (1981-07-01), Barry
patent: 4478882 (1984-10-01), Roberto
patent: 4554732 (1985-11-01), Sadlo

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