Method and apparatus for through hole substrate printing

Details Method and apparatus for through hole substrate printing Method and apparatus for through hole substrate printing

1990-04-02

1992-01-14

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 96, 427 98, C23C 2600

Patent

active

050809296

ABSTRACT:
A method and apparatus are disclosed for enabling automated printing of through holes extending between top and bottom surfaces of a ceramic substrate or the like. The perimeter of the substrate is placed on a support that locates the bottom surface of the substrate spaced from a member that interacts with the interior portion of the substrate. The interacting member has holes that correspond to the through holes in the substrate, and it is moved generally perpendicular to the substrate to a position where it is in juxtaposition with the bottom surface of the substrate and its holes are in registration with the holes in the substrate. Conductive material is applied to the top surface of the substrate and a vacuum is applied to the holes in the interacting member to pull the conductive material through the through holes in the substrate. The vacuum is then discontinued and the interacting member is moved back to a position where it is spaced from the bottom surface of the substrate.

REFERENCES:
patent: 4323593 (1982-04-01), Tsunashima
patent: 4710395 (1987-12-01), Young

Affiliated with

Also associated with

Rating

Method and apparatus for through hole substrate printing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for through hole substrate printing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for through hole substrate printing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-540269