Image analysis – Applications – Manufacturing or product inspection
Patent
1998-01-16
2000-06-06
Mehta, Bhavesh
Image analysis
Applications
Manufacturing or product inspection
382144, 382151, 348 95, 702150, 356376, 25055934, G06K 900
Patent
active
060728981
ABSTRACT:
A calibration and part inspection method and apparatus for the inspection of ball grid array, BGA, devices. Two cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A first camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into a second camera and a second additional mirror or prism located below the bottom plane of the reticle reflects the opposite side view of the reticle pattern mask through prisms or mirrors into a second camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution. The reticle with the pattern mask is removed after calibration and the BGA to be inspected is placed with the balls facing downward, in such a manner as to be imaged by the two cameras. The scene of the part can thus be triangulated and the dimensions of the BGA are determined.
REFERENCES:
patent: 4521807 (1985-06-01), Werson
patent: 4638471 (1987-01-01), van Rosmalen
patent: 4677473 (1987-06-01), Kazunari et al.
patent: 4731855 (1988-03-01), Suda et al.
patent: 4825394 (1989-04-01), Beamish et al.
patent: 4886958 (1989-12-01), Merryman et al.
patent: 4943722 (1990-07-01), Breton et al.
patent: 5058178 (1991-10-01), Ray
patent: 5095447 (1992-03-01), Manns et al.
patent: 5113581 (1992-05-01), Hidese
patent: 5133601 (1992-07-01), Cohen et al.
patent: 5140643 (1992-08-01), Izumi et al.
patent: 5173796 (1992-12-01), Palm et al.
patent: 5204734 (1993-04-01), Cohen et al.
patent: 5245671 (1993-09-01), Kobayashi et al.
patent: 5276546 (1994-01-01), Palm et al.
patent: 5307149 (1994-04-01), Palm et al.
patent: 5355221 (1994-10-01), Cohen et al.
patent: 5420689 (1995-05-01), Sin
patent: 5420691 (1995-05-01), Kawaguchi
patent: 5430548 (1995-07-01), Hiroi et al.
patent: 5452080 (1995-09-01), Tomiya
patent: 5465152 (1995-11-01), Bilodeau et al.
patent: 5546189 (1996-08-01), Svetkoff et al.
patent: 5550763 (1996-08-01), Michael et al.
patent: 5563702 (1996-10-01), Emery et al.
patent: 5563703 (1996-10-01), Lebeau et al.
patent: 5574668 (1996-11-01), Beaty
patent: 5574801 (1996-11-01), Collet-Beillon
patent: 5581632 (1996-12-01), Koljonen
patent: 5592562 (1997-01-01), Rooks
patent: 5600150 (1997-02-01), Stern et al.
patent: 5617209 (1997-04-01), Svetkoff et al.
patent: 5621530 (1997-04-01), Marrable, Jr.
patent: 5648853 (1997-07-01), Stern et al.
patent: 5652658 (1997-07-01), Jackson et al.
patent: 5654800 (1997-08-01), Svetkoff et al.
patent: 5692070 (1997-11-01), Kobayashi
patent: 5734475 (1998-03-01), Pai
patent: 5761337 (1998-06-01), Nishimura et al.
patent: 5801966 (1998-09-01), Ohashi
patent: 5812268 (1998-09-01), Jackson et al.
patent: 5812269 (1998-09-01), Svetkoff et al.
patent: 5815275 (1998-09-01), Svetkoff et al.
patent: 5818061 (1998-10-01), Stern et al.
patent: 5828449 (1998-10-01), King et al.
patent: 5859698 (1999-01-01), Chau et al.
patent: 5859924 (1999-01-01), Liu et al.
patent: 5870489 (1999-02-01), Yamazaki et al.
patent: 5943125 (1999-08-01), King et al.
CI-8250, The Complete High-Speed Inspection System, ICOS' Products, 6 pages, Mar. 1997.
Beaty Elwin M.
Mork David P.
Mehta Bhavesh
Moffa Emil
Sun Hans I.
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