Method and apparatus for thermoforming of plastic sheets

Details Method and apparatus for thermoforming of plastic sheets Method and apparatus for thermoforming of plastic sheets

2005-09-13

2005-09-13

Yao, Sam Chuan (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S285000, C156S382000

Reexamination Certificate

active

06942751

ABSTRACT:
A method of forming plastics sheets, comprises the steps of supporting a die (or substrate12) between plastics sheets36in an enclosure, heating the plastics sheets36by infra-red heating element28, evacuating air from the enclosure, and urging the plastics sheets36into contact with opposite faces of the die (or substrate12) while maintaining a vacuum or a substantial vacuum between the plastics sheets36. Apparatus for performing this method is also disclosed.

REFERENCES:
patent: 3322601 (1967-05-01), Wong et al.
patent: 3383265 (1968-05-01), Garabedian
patent: 3964958 (1976-06-01), Johnston
patent: 4127436 (1978-11-01), Friel
patent: 4152188 (1979-05-01), Friedrich et al.
patent: 4366663 (1983-01-01), Grebe
patent: 5387452 (1995-02-01), Addeo et al.
patent: 6041840 (2000-03-01), Ogawa
patent: 3706443 (1988-09-01), None
patent: 0302703 (1989-02-01), None
patent: 0 339 275 (1989-11-01), None
patent: 54-132675 (1979-10-01), None
patent: 62-270319 (1987-11-01), None
patent: 3-150126 (1991-01-01), None
patent: 4-14434 (1992-01-01), None
patent: 63-214424 (1998-09-01), None
patent: 10-315257 (1998-12-01), None
patent: WO 99/25515 (1999-05-01), None

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