Method and apparatus for thermo-compression diffusion bonding

Details Method and apparatus for thermo-compression diffusion bonding Method and apparatus for thermo-compression diffusion bonding

1980-04-11

1981-02-24

Ramsey, Kenneth J.

Metal fusion bonding

Process

Diffusion type

228205, 228219, 228243, 228263G, B23K 2002, B23K 2014

Patent

active

042522633

ABSTRACT:
A method which utilizes thermo-compression diffusion bonding to attach a metal foil to structured copper. The different rate of expansion of metal press members with temperature creates a force which squeezes the foil and copper together to achieve a bond when the press and the parts to be joined are heated to an elevated temperature. Because of the high pressure achieved by the press, diffusion bonding occurs at a low enough temperature to avoid problems associated with use of the liquid phase of any of the metals undergoing bonding.

REFERENCES:
patent: 3295089 (1966-12-01), Moore
patent: 3657611 (1972-04-01), Yoneda
patent: 3761783 (1973-09-01), Kroger et al.
patent: 3896256 (1975-07-01), Wolski
patent: 4046305 (1977-09-01), Brown et al.
Cunningham et al., "The Mechanism of Pressure Bonding" Battelle Memorial Institute Report BM1-1512 Apr. 1961.

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