Semiconductor device manufacturing: process – Miscellaneous
Reexamination Certificate
2006-08-29
2006-08-29
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Miscellaneous
C034S413000, C429S004000
Reexamination Certificate
active
07098157
ABSTRACT:
A method and apparatus for thermally treating disk-shaped substrates, especially semiconductor wafers, in a rapid heating unit having at least one first radiation source, which is spaced from a given substrate for heating the substrate. The substrate is heated in a heating phase and is cooled in a cooling phase that follows the heating phase. During at least a portion of the cooling phase, the substrate is supported at a distance of from 50 μm to 1 mm via ultrasonic levitation from a heating/cooling plate. For example by means of an ultrasonic electrode.
REFERENCES:
patent: 4958061 (1990-09-01), Wakabayashi et al.
patent: 4962330 (1990-10-01), Lierke et al.
patent: 5810155 (1998-09-01), Hashimoto et al.
patent: 6284051 (2001-09-01), Fidelman
patent: 6410888 (2002-06-01), Pan
patent: 6717112 (2004-04-01), Probst
patent: 6770146 (2004-08-01), Koren et al.
patent: 6800833 (2004-10-01), Gregor et al.
patent: 2002/0102098 (2002-08-01), Camm et al.
patent: 2002/0116836 (2002-08-01), Morad et al.
patent: 36 08 783 (1987-09-01), None
patent: 199 16 872 (1999-04-01), None
patent: 199 05 524 (2000-09-01), None
patent: 61001017 (1984-06-01), None
patent: 11301832 (1999-11-01), None
patent: 59215718 (2005-05-01), None
patent: WO 00/46840 (2000-08-01), None
patent: WO 00/61474 (2000-10-01), None
patent: WO 02/090222 (2002-11-01), None
patent: WO 03/076313 (2003-09-01), None
Puu-An Juang et al., “Vibration Characteristic Identification by Experiment of a New Disc-Type Ultrasonic Stator”, Institute of Physics, Journal of Micromechanica Microengineering, vol. 12, pp. 598-603, 2002.
T. Otsuka et al, “Consideration of Sample Dimension for Ultrasonic Levitation”, IEEE Ultrasonic Symposium, pp. 1271-1274, 1990.
Sadayuki Ueha “Recent Development of Ultrasonic Actuators”, IEEE Ultrasonic Symposium, pp. 513-520, 2001.
Article “Holding characteristics of . . . ”—Matsuo.
Article “A Multi-Transducer Newr”—Amano.
Coleman W. David
Dority & Manning P.A.
Mattson Thermal Products GmbH
LandOfFree
Method and apparatus for thermally treating disk-shaped... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for thermally treating disk-shaped..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for thermally treating disk-shaped... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3683444