Method and apparatus for thermally assisted testing of...

Details Method and apparatus for thermally assisted testing of... Method and apparatus for thermally assisted testing of...

2006-08-08

2006-08-08

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Interconnecting plural devices on semiconductor substrate

C257S678000

Reexamination Certificate

active

07087439

ABSTRACT:
A system and method for thermally testing integrated circuits, comprising a temperature generation device located within the IC, configured with a primary purpose of affecting a temperature at the IC. A temperature sensor is located within close proximity to the IC, and a temperature controller is coupled to the temperature generation device and to the temperature sensor.

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patent: 6545494 (2003-04-01), Olsen et al.
patent: 6791171 (2004-09-01), Mok et al.
patent: 2003/0158697 (2003-08-01), Gold et al.

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